Shanghai, China

Bangzhong Cai

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Huawei Technologies Co., Limited. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bangzhong Cai. Retrieved from https://idiyas.com/inventor/bangzhong-cai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Bangzhong Cai: Innovator in Multi-Chassis Interconnection Systems

Introduction

Bangzhong Cai is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of multi-chassis interconnection systems. His innovative approach addresses critical challenges in data exchange among interconnected systems.

Latest Patents

Bangzhong Cai holds a patent for a "System for multi-chassis interconnection and method for chassis connection." This invention includes at least three chassis, each equipped with a first switch fabric unit (SFU) and a second SFU. The first SFU in one chassis connects to the first SFU in other chassis, while the second SFU in another chassis connects to the second SFU in other chassis. This design allows for continued data exchange among chassis even when the main chassis experiences faults, overcoming limitations found in prior art.

Career Highlights

Bangzhong Cai is currently employed at Huawei Technologies Co., Limited, a leading global technology company. His work focuses on enhancing the reliability and efficiency of multi-chassis systems. With a patent portfolio that includes 1 patent, he has established himself as a key figure in his field.

Collaborations

Some of his notable coworkers include Guoxing Yang and Siwei Wang. Their collaborative efforts contribute to the advancement of technology at Huawei.

Conclusion

Bangzhong Cai's innovative work in multi-chassis interconnection systems showcases his commitment to solving complex technical challenges. His contributions are vital for the future of interconnected systems and data exchange.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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