Singapore, Singapore

Bangtao Chen

USPTO Granted Patents = 2 

Average Co-Inventor Count = 6.4

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016-2023

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2 patents (USPTO):

Title: Bangtao Chen: Innovator in Acoustic Device Packaging

Introduction

Bangtao Chen is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor technology. He holds two patents that showcase his innovative approach to improving acoustic devices.

Latest Patents

His latest patents include a "Packaging structure and method of acoustic device" and "Layer arrangement and a wafer level package comprising the layer arrangement." The first patent focuses on a packaging structure that enhances the performance of acoustic devices by reducing the loss of acoustic waves through a carefully designed layer arrangement. The second patent relates to a layer arrangement that includes a getter layer and a sacrificial layer, specifically aimed at microelectromechanical systems (MEMS) packaging at low vacuum levels.

Career Highlights

Bangtao Chen has worked with prominent organizations such as the Agency for Science, Technology and Research and Wuhan Memsonics Technologies Co., Ltd. His experience in these institutions has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

He has collaborated with notable colleagues, including Vivek Chidambaram and Ling Xie, contributing to advancements in their respective fields.

Conclusion

Bangtao Chen's work in acoustic device packaging and semiconductor technology highlights his role as a significant innovator. His patents reflect a commitment to enhancing device performance and advancing the field.

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