Bance Hom

Title: The Innovative Contributions of Bance Hom in High Frequency Device Packaging

Introduction: Bance Hom is an accomplished inventor based in Reno, NV, recognized for her significant contributions to the field of high frequency device packaging. With a total of two patents to her name, Bance has developed advanced methods that enhance the performance and reliability of high frequency devices.

Latest Patents: Bance's latest patents include a novel process for manufacturing high frequency device packages. This innovative method involves the selective etching of an insulating material attached to a flat surface, followed by the plating of the etched insulating material with a conductive material. This process ultimately forms a center conductor for a coaxial via structure. Additionally, she has patented a packaging method and resulting package that form coaxial structures from the high frequency device to the via, including a coaxial via structure and micro-coaxial bonding wire.

Career Highlights: Bance Hom is currently employed at Bridgewave Communications, Inc., where her expertise in high frequency technology is instrumental in the company's advancements. Her contributions have not only advanced her organization's capabilities but have also played a key role in shaping industry standards for high frequency devices.

Collaborations: Throughout her career, Bance has collaborated with notable colleagues, including Eliezer Pasternak and Sean S. Cahill. These partnerships have fostered a dynamic work environment where innovative ideas can flourish and lead to transformative advancements.

Conclusion: Bance Hom's contributions to high frequency device packaging highlight her innovative spirit and expertise in the field. With her groundbreaking patents and collaborative approach at Bridgewave Communications, Inc., she continues to shape the future of high frequency technology. Her work not only benefits her company but also contributes to the broader advancement of electronics and telecommunications.