Baichuan Liu

Title: Baichuan Liu: Innovator in Electroplating Technology

Introduction

Baichuan Liu is a notable inventor based in Shanghai, China. He has made significant contributions to the field of electroplating, particularly with his innovative patent that enhances the bonding of copper wire. His work is essential for various applications in electronics and materials science.

Latest Patents

Baichuan Liu holds a patent titled "Bonding copper wire plated with palladium and gold and electroplating process thereof." This patent focuses on an advanced electroplating process that involves multiple layers of palladium and gold on copper wire. The process includes electroplating a first palladium layer, followed by a gold layer, and then additional layers of palladium and gold to create a finished product. The specific components of the palladium plating solution include tetraamminepalladium acetate, 4-sulfamoylbenzoic acid, and 6-azauracil. This innovative approach improves the quality and durability of the electroplated wire.

Career Highlights

Baichuan Liu is currently employed at Shanghai Wonsung Alloy Material Co., Ltd. His role at the company allows him to apply his expertise in electroplating and contribute to the development of advanced materials. His work has positioned him as a key figure in the industry, particularly in the realm of alloy materials.

Collaborations

Baichuan Liu collaborates with several talented individuals, including his coworkers Shi Liu and Yi Liu. Their combined efforts in research and development have led to advancements in electroplating technologies and materials.

Conclusion

Baichuan Liu's contributions to the field of electroplating through his innovative patent demonstrate his commitment to advancing technology. His work at Shanghai Wonsung Alloy Material Co., Ltd. and collaborations with colleagues further enhance his impact in the industry.