Tokyo, Japan

Ayasa Ohkura

This inventor holds 3 USPTO granted patents and 1 published patent application, plus 1 CIPO patent and 1 EPO patent. Top assignee: Nippon Paper Industries Co., Ltd.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ayasa Ohkura. Retrieved from https://idiyas.com/inventor/ayasa-ohkura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 3 

% Patents Active = 100.0


 

Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2020

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3 patents (USPTO):Explore Patents

Title: Ayasa Ohkura: Innovator in Packaging Solutions

Introduction

Ayasa Ohkura is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of packaging, holding a total of 3 patents. His work focuses on innovative solutions that enhance the functionality and sustainability of packaging materials.

Latest Patents

One of his latest patents is a unique packaging design that aims to improve the efficiency and usability of packaging products. This invention reflects his commitment to advancing packaging technology and addressing the needs of modern consumers.

Career Highlights

Ayasa Ohkura is currently employed at Nippon Paper Industries Co., Ltd., a leading company in the paper and packaging industry. His role at the company allows him to leverage his expertise in developing innovative packaging solutions that meet industry standards and consumer demands.

Collaborations

Throughout his career, Ayasa has collaborated with talented individuals such as Kouya Nakamura and Yoshihiro Urano. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking packaging technologies.

Conclusion

Ayasa Ohkura is a dedicated inventor whose work in packaging innovation continues to make a significant impact in the industry. His contributions not only enhance product usability but also promote sustainability in packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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