Venette, France

Aurelien Wiegand

This inventor holds 1 USPTO granted patent. Top assignee: Bostik Sa. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Aurelien Wiegand. Retrieved from https://idiyas.com/inventor/aurelien-wiegand

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Aurelien Wiegand: Innovator in Adhesive Technology

Introduction

Aurelien Wiegand is a notable inventor based in Venette, France. He has made significant contributions to the field of adhesive technology, particularly through his innovative patent in hot-melt pressure-sensitive adhesives.

Latest Patents

Wiegand holds a patent for a hot-melt pressure-sensitive adhesive composition based on polyurethane and (meth)acrylic. This composition features a specific ratio of polyurethane(s) to tackifying resin(s) that ranges from 4:6 to 6:4. The polyurethane utilized in this composition has a mean functionality of functional groups of formula (I) that is strictly greater than 1.9. This innovation enhances the performance and applicability of adhesive products in various industries.

Career Highlights

Aurelien Wiegand is currently employed at Bostik SA, a leading company in adhesive solutions. His work at Bostik has allowed him to focus on developing advanced adhesive technologies that meet the evolving needs of the market.

Collaborations

Wiegand collaborates with talented professionals in his field, including Guillaume Michaud and Stephane Fouquay. These collaborations foster a creative environment that drives innovation and enhances product development.

Conclusion

Aurelien Wiegand's contributions to adhesive technology through his patent and work at Bostik SA highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of adhesive applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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