Neuotting, Germany

August Freudlsperger


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 1980

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1 patent (USPTO):Explore Patents

Title: August Freudlsperger: Innovator in Machining Technology

Introduction

August Freudlsperger is a notable inventor based in Neuotting, Germany. He has made significant contributions to the field of machining technology, particularly with his innovative apparatus designed for machining workpieces by abrasion. His work has implications for various industries, especially in semiconductor manufacturing.

Latest Patents

Freudlsperger holds a patent for an "Apparatus for machining workpieces by abrasion." This apparatus utilizes an oscillating multiple-blade tool that moves across the workpiece. The design incorporates an oscillatory system where the moved masses define the energy storage in the reversal ranges through a buffer system. This technology is particularly effective when used as a lap-cutting machine for cutting semiconductor rods. The apparatus is driven by the oscillation of the masses and operates in the resonance range, with tool carriages that are buffer loaded at each end and oscillated at or near the natural resonance frequency of the moving masses.

Career Highlights

Freudlsperger is associated with Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, where he has applied his expertise in machining technology. His innovative approach has positioned him as a key figure in the development of advanced machining solutions.

Collaborations

Freudlsperger has worked alongside notable colleagues such as Dieter Seifert and Dieter Regler. Their collaborative efforts have contributed to advancements in the field of electronics and machining technologies.

Conclusion

August Freudlsperger's contributions to machining technology, particularly through his patented apparatus, highlight his role as an innovator in the industry. His work continues to influence the development of efficient machining processes, especially in the semiconductor sector.

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