Company Filing History:
Years Active: 2000-2009
Title: The Innovations of Atsuya Narai
Introduction
Atsuya Narai is a prominent inventor based in Yamatokoriyama, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on improving manufacturing methods and device efficiency.
Latest Patents
One of his latest patents is a semiconductor device and manufacturing method that utilizes a ball bonding method adopting a reverse technique. In this method, a substrate and multiple semiconductor chips stacked on the substrate are interconnected. The process begins with first bonding on a bonding pad on the substrate, followed by leading a gold wire to a bonding pad of a semiconductor chip on the bottom layer. A second bonding forms a wire that connects the substrate and the bottom layer semiconductor chip. This innovative approach allows for reduced package size, sufficient clearance between wires, and fewer restrictions on the combinations of semiconductor chips that can be stacked.
Career Highlights
Atsuya Narai has been instrumental in advancing semiconductor technology through his work at Sharp Kabushiki Kaisha Corporation. His expertise in manufacturing methods has led to significant improvements in device performance and efficiency.
Collaborations
He has collaborated with notable coworkers, including Yasuki Fukui and Yoshiki Sota, contributing to various projects that enhance semiconductor technology.
Conclusion
Atsuya Narai's contributions to semiconductor technology through his innovative patents and collaborative efforts have made a lasting impact in the field. His work continues to influence advancements in manufacturing methods and device efficiency.