The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2003
Filed:
Jan. 15, 2002
Applicant:
Inventors:
Yasuki Fukui, Sakai, JP;
Atsuya Narai, Yamatokoriyama, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/940 ; H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/940 ; H01L 2/302 ;
Abstract
A semiconductor device includes a first semiconductor chip and a second semiconductor chip which are laminated on a substrate, wherein electrode terminals which are provided on each of the semiconductor chips are electrically connected to the substrate by first bonding wires and second bonding wires, and an insulation layer is formed between the second bonding wires and the first semiconductor chip.
Quick Actions:
Fukui, Yasuki. (2003). Semiconductor device having insulation layer and adhesion layer between chip lamination (U.S. Patent No. 6657290). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6657290
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile