Osaka, Japan

Atsushi Tatami

USPTO Granted Patents = 11 

 

Average Co-Inventor Count = 3.1

ph-index = 1

Forward Citations = 8(Granted Patents)


Location History:

  • Settsu, JP (2017)
  • Osaka, JP (2019 - 2023)

Company Filing History:


Years Active: 2017-2023

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11 patents (USPTO):Explore Patents

Title: Innovations of Atsushi Tatami in Thermal Interface Materials

Introduction

Atsushi Tatami is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of thermal interface materials, holding a total of 11 patents. His work focuses on enhancing heat transfer efficiency through innovative materials and methods.

Latest Patents

Tatami's latest patents include advancements in thermal interface materials, specifically methods for thermally coupling with these materials. One notable invention involves a thermal interface material designed to transfer heat by interposing between two materials, which includes a graphite film. This graphite film can have a thickness ranging from 200 nm to 3 µm, with a specific ratio of arithmetic average roughness to thickness. Another patent details a thermal interface material with a thickness of 1 µm to 50 µm, a density between 1.40 g/cm³ to 2.26 g/cm³, and a thermal conductivity of 500 W/mK to 2000 W/mK in the film plane direction.

Career Highlights

Throughout his career, Atsushi Tatami has worked with notable companies such as Kaneka Corporation and Riken Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in thermal management technologies.

Collaborations

Tatami has collaborated with esteemed colleagues, including Mutsuaki Murakami and Masamitsu Tachibana. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.

Conclusion

Atsushi Tatami's contributions to thermal interface materials demonstrate his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of material science and its applications in improving thermal management solutions.

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