Kawasaki, Japan

Atsushi Miyadera

This inventor holds 1 USPTO granted patent. Top assignee: Incs, Inc.. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Atsushi Miyadera. Retrieved from https://idiyas.com/inventor/atsushi-miyadera

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Atsushi Miyadera: Innovator in Die Design Support Systems

Introduction

Atsushi Miyadera is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of die design through his innovative methods and systems. His work aims to simplify the die design process, making it accessible to engineers of varying skill levels.

Latest Patents

Miyadera holds a patent for a "Die design support method and die design support system." This invention provides a solution to reduce the time required for die design. It allows unskilled die engineers to perform designs without difficulties and accommodates product design changes efficiently. The method involves storing a standard die design procedure as 'master die data' in advance, utilizing a CAD system. When product design data is entered, the design procedure is automatically executed according to the stored master die data.

Career Highlights

Miyadera has worked at Incs, Inc., where he has applied his expertise in die design. His innovative approach has garnered attention in the industry, showcasing his ability to enhance design processes.

Collaborations

Miyadera collaborates with talented coworkers, including Takao Ikeda and Atsushi Sakurai. Their combined efforts contribute to advancements in die design technology.

Conclusion

Atsushi Miyadera's contributions to die design support systems exemplify his commitment to innovation. His patent reflects a significant advancement in making die design more efficient and accessible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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