Hiratsuka, Japan

Atsushi Ehira


Average Co-Inventor Count = 7.2

ph-index = 5

Forward Citations = 89(Granted Patents)


Location History:

  • Fujisawa, JP (1997)
  • Kanagawa, JP (1999 - 2006)
  • Hiratsuka, JP (2007)

Company Filing History:


Years Active: 1997-2007

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5 patents (USPTO):Explore Patents

Title: Atsushi Ehira: Innovator in Heat Dissipation Technologies

Introduction

Atsushi Ehira is a notable inventor based in Hiratsuka, Japan. He has made significant contributions to the field of heat dissipation technologies, holding a total of five patents. His work focuses on improving the efficiency and effectiveness of heat management in electronic devices.

Latest Patents

One of his latest patents is titled "Heat dissipation assembly and method for producing the same." This invention features a heat dissipation assembly that integrates a heat generator and a heat dissipator through an electrically insulating and thermally conductive sheet. The assembly utilizes thermally conductive grease that is incompatible with the insulating sheet, allowing for effective heat dissipation while maintaining electrical insulation over extended periods. Another significant patent is the "Insulation sheet and apparatus utilizing the same." This insulation sheet is composed of a heat conductive filler, making up 70–93 mass % in an organopolysiloxane base material, with a low content of conductive impurities. This sheet is designed to be placed between a semiconductor device and a heat sink, enhancing thermal management.

Career Highlights

Atsushi Ehira has worked with Nissan Motor Company Limited, where he applied his expertise in heat management technologies. His innovative approaches have contributed to advancements in the automotive industry, particularly in the development of efficient thermal systems.

Collaborations

He has collaborated with notable colleagues such as Hideaki Kawata and Kei Ishii, further enhancing his contributions to the field.

Conclusion

Atsushi Ehira's work in heat dissipation technologies showcases his innovative spirit and dedication to improving electronic device performance. His patents reflect a commitment to advancing thermal management solutions in various applications.

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