Tokyo, Japan

Atsuko Chigira

This inventor holds 2 USPTO granted patents. Top assignees: Dai Nippon Printing, Dai Nippon Printing Co., Ltd.. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Atsuko Chigira. Retrieved from https://idiyas.com/inventor/atsuko-chigira

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 50.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024-2026

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2 patents (USPTO):Explore Patents

Title: Atsuko Chigira: Innovator in Wiring Board Technology

Introduction

Atsuko Chigira is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of wiring board technology. Her innovative approach has led to the development of a unique wiring board that enhances manufacturing methods.

Latest Patents

Atsuko Chigira holds a patent for a wiring board and its manufacturing method. The patent describes a wiring board that includes a substrate with a first element, a diffusion layer in contact with the substrate that contains a first metal element, and a first metal film in contact with the diffusion layer that includes a second metal element. The design allows for a concentration gradient of the metal elements, optimizing the performance of the wiring board.

Career Highlights

Atsuko Chigira is associated with Dai Nippon Printing Co., Ltd., where she has been instrumental in advancing wiring board technologies. Her work has been recognized for its innovative approach and practical applications in the industry.

Collaborations

Atsuko collaborates with notable colleagues, including Hiroki Furushou and Toshio Sasao. Their combined expertise contributes to the success of their projects and innovations.

Conclusion

Atsuko Chigira is a trailblazer in wiring board technology, with a patent that showcases her innovative spirit. Her contributions continue to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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