This inventor holds 1 USPTO granted patent. Top assignee: National Institute of Advanced Industrial Science and Technology. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: Atsuhiko Maeda: Innovator in MEMS Packaging Technology
Introduction
Atsuhiko Maeda is a prominent inventor based in Ibaraki, Japan. He has made significant contributions to the field of microelectromechanical systems (MEMS) packaging technology. His innovative approach has led to advancements that enhance the efficiency and effectiveness of MEMS devices.
Latest Patents
Atsuhiko Maeda holds a patent for a "Package formation method and MEMS package." This invention includes a sacrificial thin film formation step for chemical-mechanical polishing a temporary substrate made of a readily polishable material. It also involves sputtering a metal thin film along the smoothly polished surface. The process includes a first bonding step for forming a sealing frame by bringing at least a noble metal on the metal thin film and bonding a substrate on the sealing frame. Additionally, the invention features a temporary substrate removal step for removing the metal thin film along with the temporary substrate, exposing a new surface at the tip of the sealing frame. Finally, a second bonding step is included, which involves sputtering a noble metal thin film around a precision machine element on the machine substrate, bringing the new surface of the sealing frame into contact with the noble metal thin film, and bonding the new surface of the sealing frame onto the noble metal thin film at room temperature.
Career Highlights
Atsuhiko Maeda is affiliated with the National Institute of Advanced Industrial Science and Technology, where he continues to push the boundaries of MEMS technology. His work has been instrumental in developing methods that improve the reliability and performance of MEMS devices.
Collaborations
Throughout his career, Atsuhiko Maeda has collaborated with notable colleagues, including Yuuichi Kurashima and Hideki Takagi. These collaborations have fostered a productive environment for innovation and research.
Conclusion
Atsuhiko Maeda's contributions to MEMS packaging technology exemplify the impact of innovative thinking in engineering. His patent and ongoing work at the National Institute of Advanced Industrial Science and Technology highlight his commitment to advancing technology in this critical field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile