This inventor holds 1 USPTO granted patent. Top assignee: Lsi Logic Corporation. Active years: 1999.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1999
Title: Ashok Domadia: Innovator in Flip Chip Packaging Technology
Introduction
Ashok Domadia is a notable inventor based in San Jose, California. He has made significant contributions to the field of flip chip packaging technology. His innovative designs have paved the way for advancements in electronic assembly processes.
Latest Patents
Domadia holds a patent for a "Stiffener ring and heat spreader for use with flip chip packaging." This invention features a stiffener device designed for flip chip packaging assemblies. The device includes a generally rectangular, plate-like member with a uniform thickness. Each corner of the member has a curved chamfer portion that accommodates mounting bolts. The fabrication process involves a single stamping or punching operation, ensuring a planar upper and lower surface.
Career Highlights
Ashok Domadia is currently associated with LSI Logic Corporation, where he applies his expertise in electronic packaging. His work has been instrumental in enhancing the reliability and performance of electronic devices.
Collaborations
Domadia has collaborated with various professionals in his field, including his coworker Manickam Thavarajah. Their combined efforts have contributed to the development of innovative solutions in electronic packaging.
Conclusion
Ashok Domadia's contributions to flip chip packaging technology exemplify his commitment to innovation. His patent and work at LSI Logic Corporation highlight his role as a key player in advancing electronic assembly techniques.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile