Location History:
- Tempe, AZ (US) (2016)
- Scottsdale, AZ (US) (2017)
Company Filing History:
Years Active: 2016-2017
Title: Ashlee Murphy: Innovator in Wafer Bonding Technologies
Introduction
Ashlee Murphy is a prominent inventor based in Scottsdale, AZ (US). She has made significant contributions to the field of wafer bonding technologies, holding 2 patents that showcase her innovative approaches.
Latest Patents
Her latest patents include methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization. These methods involve contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly in the presence of a steam atmosphere. This process is conducted under suitable conditions to create a bonding layer between the two surfaces. The first bonding surface features a polarized surface layer, while the second bonding surface has a hydrophilic surface layer, ensuring that the two surfaces are distinct. Additionally, she has developed methods for wafer bonding and for nucleating bonding nanophases, which also involve compressing the assembly in an oxidizing atmosphere to form a bonding layer.
Career Highlights
Ashlee Murphy is affiliated with Arizona State University, where she continues to advance her research and innovation in wafer bonding technologies. Her work has garnered attention for its potential applications in various industries.
Collaborations
She collaborates with notable colleagues, including Robert Culbertson and Ross Bennett-Kennett, contributing to a dynamic research environment.
Conclusion
Ashlee Murphy's innovative work in wafer bonding technologies positions her as a key figure in her field. Her patents reflect her commitment to advancing technology and her contributions to the scientific community are noteworthy.