Arizona State University

Ashlee Murphy

Robert Culbertson

Ross Bennett-Kennett

Nicole Herbots

Shawn Whaley

Nichole Herbots

Brett Hughes

Ajjya Acharya

Matthew Bade

Clarizza Watson

Sam Farmer

Brance Hudzietz

Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly in the presence of an steam atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.

Methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization

Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly, and compressing the assembly in the presence of an oxidizing atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.

Methods for wafer bonding, and for nucleating bonding nanophases

Growing community of inventors

Scottsdale, AZ, United States of America

Ashlee Murphy