IDiyas

For the Inventor, By the Inventor

Vestal, NY, United States of America

Ashit A Mehta

USPTO Granted Patents = 13

Average Co-Inventor Count = 5.9

ph-index = 8

Forward Citations = 218(Granted Patents)


Company Filing History:

goldMedal13 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1991-1997

where 'Filed Patents' based on already Granted Patents

13 patents (USPTO):
1. 5667934 - Thermally stable photoimaging composition (1997-09-16),
2. 5665526 - Thermally stable photoimaging composition (1997-09-09),
3. 5614250 - Coated filler and use thereof (1997-03-25),
4. 5607744 - Coated filler and use thereof (1997-03-04),
5. 5591285 - Fluorinated carbon polymer composites (1997-01-07),
6. 5571852 - Fluorinated carbon polymer composites (1996-11-05),
7. 5556899 - Fluorinated carbon polymer composites (1996-09-17),
8. 5397863 - Fluorinated carbon polymer composites (1995-03-14),
9. 5319244 - Triazine thin film adhesives (1994-06-07),
10. 5250347 - Mechanically enhanced, high impact strength triazine resins, and method (1993-10-05),
11. 5206074 - Adhesives on polymide films and methods of preparing them (1993-04-27),
12. 5153986 - Method for fabricating metal core layers for a multi-layer circuit board (1992-10-13),
13. 5055342 - Fluorinated polymeric composition, fabrication thereof and use thereof (1991-10-08),

Title: **Innovator Spotlight: Ashit A Mehta**

Introduction

Ashit A Mehta is a prolific inventor based in Vestal, NY, USA, known for his significant contributions to the field of photoimaging and circuit board technology. With a remarkable portfolio of 13 patents, he has made strides in developing innovative solutions that enhance the performance and reliability of electronic components.

Latest Patents

One of his latest patents is a thermally stable photoimaging composition, which has been designed specifically for use on circuit boards as a solder mask. This innovative composition includes a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. Notably, it features a coefficient of thermal expansion of about 28-40 ppm/°C, ensuring it closely matches the thermal expansion of the solder used on circuit board components. This discovery represents a significant advancement in the reliability of electronic devices, enhancing their durability under heat.

Career Highlights

Ashit has made his mark at International Business Machines Corporation (IBM), where he has played a pivotal role in the development of cutting-edge technologies. His inventive work has not only spurred innovation within the company but has also set industry standards within the electronics sector.

Collaborations

Throughout his career, Ashit has collaborated with esteemed colleagues such as David W. Wang and Eugene R. Skarvinko. These partnerships have fostered a dynamic environment for research and development, driving forward the creation of solutions that meet the demands of modern technology.

Conclusion

Ashit A Mehta's innovative contributions to the field of electronics, particularly in photoimaging compositions for circuit boards, highlight his role as a significant player in the industry. As technology continues to evolve, his work sets a precedent for future innovations that enhance performance and reliability. His achievements not only reflect his expertise but also his commitment to advancing technology.

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