Inazawa, Japan

Asao Okuda


Average Co-Inventor Count = 15.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Exploring the Innovations of Asao Okuda

Introduction:

Asao Okuda, an inventive spirit hailing from Inazawa, Japan, has made noteworthy contributions to the field of bonded assemblies. With a single patented invention to his name, Okuda has demonstrated a unique approach to jointing methods that enhance the reliability and strength of connections between boards.

Latest Patents:

His patent, titled "Bonded assembly, method of jointing for preparation thereof and rivet," presents an innovative method for creating bonded assemblies. This invention features a distinct design characterized by the use of adhesive between a board with a convex portion on its jointing surface and another board that possesses either a concave portion or a through hole. Okuda’s patent outlines that the adhesive is applied to areas excluding the convex portion, ensuring that the coating thickness remains less than the height of the convex section. This meticulous application not only facilitates accurate board alignment but also safeguards against adhesive contact with unnecessary areas, ultimately increasing the strength of the bonded assembly. Furthermore, the rivet concept introduced by Okuda provides a simplified means for temporary fixing, enhancing the overall efficiency of the jointing process.

Career Highlights:

Asao Okuda's professional journey has been primarily associated with Mitsubishi Electric Corporation, where he has played a significant role in research and development. His innovative contributions in creating effective jointing systems showcase his commitment to advancing technology in bonding applications.

Collaborations:

Throughout his career, Okuda has worked alongside notable colleagues, including Kosuke Haraga and Naoki Yagi. Their collaborative efforts underline the cooperative spirit within the innovative community at Mitsubishi Electric, leading to advancements that benefit the industry as a whole.

Conclusion:

Asao Okuda’s contributions to bonded assemblies underscore his dedication to innovation in engineering. His patent not only showcases his inventive capabilities but also reflects the importance of collaboration in fostering advancements. With a focus on reliable jointing methods, Okuda continues to inspire future innovations in the field.

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