The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2000
Filed:
Oct. 19, 1995
Kosuke Haraga, Amagasaki, JP;
Naoki Yagi, Amagasaki, JP;
Yoshinobu Nakashima, Nagasaki, JP;
Yuzi Ganryu, Kobe, JP;
Tsutomu Sasaki, Amagasaki, JP;
Atsushi Takimoto, Amagasaki, JP;
Yosiro Komazawa, Chiyoda-ku, JP;
Asao Okuda, Inazawa, JP;
Shoji Takagi, Marugame, JP;
Akifumi Matsukawa, Marugame, JP;
Hideaki Urata, Wakayama, JP;
Yasushi Kawashima, Nagoya, JP;
Kazumi Masuo, Kamakura, JP;
Kenji Honma, Koriyama, JP;
Isao Ikeda, Nagasaki, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
The present invention relates to a bonded assembly characterized in that a board having a convexed portion on a jointing surface thereof and a board having, on a jointing surface thereof, a concaved portion or a through hole to be engaged with the convexed portion are jointed with adhesives. Also, the present invention relates to a bonded assembly characterized in that an adhesive is coated on the portion other than the convexed portion of the board so that the coating thickness is smaller than the height of the convexed portion, and then the board is jointed to another board having a concaved portion or a through hole, after making alignment of the boards. Further, the present invention relates to a rivet having means for fitting to and temporarily fixing to an inserting through hole, and a method of jointing boards which comprises a step for inserting, fitting and temporarily fixing the rivet having the means for temporarily fixing to the inserting through hole on the board. The present invention can provide a highly reliable bonded assembly, a method of jointing boards therefor and a rivet for facilitating jointing the boards, which assure easy and accurate alignment of the boards, secure an adhesive coating thickness required, prevent the adhesive from adhering to unnecessary portions and increase the strength as the bonded assembly.