Duisburg, Germany

Arwed Siegloch

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: O-Flexx Technologies Gmbh. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Arwed Siegloch. Retrieved from https://idiyas.com/inventor/arwed-siegloch

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Arwed Siegloch: Innovator in Thermoelectric Technology

Introduction

Arwed Siegloch is a notable inventor based in Duisburg, Germany. He has made significant contributions to the field of thermoelectric technology, particularly with his innovative designs that enhance performance while minimizing material usage.

Latest Patents

Siegloch holds a patent for a thermoelectric element that boasts high thermal resistance and requires less semiconductor material than conventional designs. This invention features a substrate with a front and rear side, two contacts applied to the front side, and a cut-off that thermally and electrically separates the contacts. The thermoelectrically active layer is strategically arranged to optimize performance, demonstrating Siegloch's expertise in this area.

Career Highlights

Arwed Siegloch is associated with O-flexx Technologies GmbH, where he continues to develop and refine his innovative ideas. His work has positioned him as a key figure in advancing thermoelectric applications.

Collaborations

Siegloch collaborates with notable colleagues such as Gerhard Span and Juergen Haferkamp, contributing to a dynamic team focused on innovation in thermoelectric technology.

Conclusion

Arwed Siegloch's contributions to thermoelectric technology exemplify his commitment to innovation and efficiency. His patent reflects a significant advancement in the field, showcasing his role as a leading inventor.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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