Arun K Chaundhuri

Title: Arun K. Chaundhuri and His Underfill Invention

Introduction

Arun K. Chaundhuri is an inventor based in Carmel, Indiana, whose work includes a patent for a method of applying underfill material in semiconductor packaging. The supplied information lists one patent associated with him and identifies Delphi Technologies, Inc. as his company.

Latest Patents

Chaundhuri’s patent, “Underfill Method,” describes selectively depositing filled underfill material onto a die without covering its solder bumps. The process microjets a polymer matrix and filler material onto the die, with an optional fluxing material. The filler is dispersed in the polymer matrix to reduce the underfill’s coefficient of thermal expansion.

The die is then placed on a substrate that has a second underfill material. Together, the materials form a composite underfill layer that fills the space between the die and substrate and creates a fillet along the die’s peripheral wall.

Career Highlights

The provided information associates Chaundhuri with Delphi Technologies, Inc. and credits him with one patent. His patented method addresses the application of underfill material in a way that leaves solder bumps uncovered during the initial deposition step.

Collaborations

The supplied data names Eric M. Berg and Derek B. Workman as Chaundhuri’s coworkers. It does not specify their roles in the patent or describe particular collaborative projects.

Conclusion

Arun K. Chaundhuri’s listed patent presents a selective underfill process designed to protect solder bumps while forming a composite layer between a semiconductor die and its substrate.