Austin, TX, United States of America

Arthur L Leerssen

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1991-1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Arthur L Leerssen. Retrieved from https://idiyas.com/inventor/arthur-l-leerssen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.3

ph-index = 2

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 1991-1993

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2 patents (USPTO):Explore Patents

Title: Arthur L Leerssen: Innovator in Solder Application Technologies

Introduction

Arthur L Leerssen is a notable inventor based in Austin, TX (US). He has made significant contributions to the field of solder application technologies, holding a total of 2 patents. His work focuses on methods and apparatus for applying solder in precise amounts, particularly for fine pitch leads.

Latest Patents

Leerssen's latest patents include innovative solutions for solder application. One of his patents, titled "Fine pitch solder application," describes methods for applying solder in precise amounts to fine pitch leads suitable for direct chip attachment or flip-chip applications. This invention utilizes a heated platen to apply pressure to solder overlaying a plurality of lands on a circuitized substrate. In one embodiment, paste solder is screened through a mask with apertures corresponding to land locations. Another embodiment involves a web of solder foil accurately positioned over fine pitch lands. Additionally, a third embodiment features individual platens for lands to which solder is to be applied.

Another significant patent by Leerssen is the "Solder placement nozzle assembly." This invention presents a nozzle assembly designed for depositing solder onto conductive surfaces, such as the mounting pads of a surface mount integrated circuit board. The assembly includes an upper nozzle mount and a removable nozzle head with an interior bore for receiving a portion of the nozzle mount and an elongate heat source. The nozzle head also features an orifice for receiving solid solder, which is then melted and dispensed through a tip opening to ensure uniform solder application on each pad.

Career Highlights

Arthur L Leerssen has had a distinguished career at International Business Machines Corporation (IBM). His work has significantly advanced the technology used in solder application, making processes more efficient and precise.

Collaborations

Throughout his career, Leerssen has collaborated with notable coworkers, including Peter G Ledermann and Alvin D Nguyen. These collaborations have contributed to the development of innovative solder application technologies.

Conclusion

Arthur L Leerssen is a prominent inventor whose work in solder application technologies has led to significant advancements in the field. His patents reflect a commitment to innovation and precision in manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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