Arnold, Emil

Title: Emil Arnold: Innovator in Silicon-On-Insulator Technology

Introduction

Emil Arnold is a notable inventor based in Chappaqua, NY (US). He has made significant contributions to the field of semiconductor technology, particularly in the development of silicon-on-insulator (SOI) wafers. His innovative approach has paved the way for advancements in thin film technology.

Latest Patents

Arnold holds a patent for a process that enables the creation of thin film silicon-on-insulator wafers. The patent describes a bond and etch-back process that allows for the production of very thin silicon film SOI devices. In this invention, boron dopant is introduced into the surface of a silicon device wafer, which is then bonded to another silicon wafer at an oxide surface. The device wafer is subsequently thinned by etching down to the doped region. Following this, annealing in hydrogen allows for the diffusion of boron out of the silicon surface layer, resulting in the production of very thin SOI films.

Career Highlights

Emil Arnold is associated with North American Philips Corporation, where he has contributed to various projects in semiconductor technology. His work has been instrumental in enhancing the efficiency and performance of silicon-based devices.

Collaborations

Arnold has collaborated with notable colleagues, including Ronald D. Pinker and Steven L. Merchant. Their combined expertise has fostered innovation and development in the field of semiconductor technology.

Conclusion

Emil Arnold's contributions to the field of silicon-on-insulator technology exemplify the impact of innovative thinking in the semiconductor industry. His patent for the process of making thin film SOI wafers showcases his commitment to advancing technology.