Company Filing History:
Years Active: 2006-2008
Title: Arlene V Layson: Innovator in Semiconductor Packaging
Introduction
Arlene V Layson is a notable inventor based in Bangkok, Thailand. She has made significant contributions to the field of semiconductor packaging, holding three patents that showcase her innovative approach to enhancing product reliability.
Latest Patents
One of her latest patents is titled "Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound." This invention involves a metal leadframe that has been treated by roughening it with a chemical etchant. The roughening process improves the adhesion between the leadframe and the molten plastic during encapsulation, thereby reducing the likelihood of separation when exposed to moisture and temperature fluctuations. In one embodiment, the leadframe, made of copper, is roughened using a chemical etchant containing sulfuric acid and hydrogen peroxide. Another patent, "Process of fabricating semiconductor packages using leadframes roughened with chemical etchant," describes a similar process and its benefits in enhancing the durability of semiconductor packages.
Career Highlights
Arlene has worked with prominent companies in the electronics sector, including Ns Electronics Bangkok Ltd. and Utac Thai Limited. Her experience in these organizations has allowed her to apply her innovative ideas in practical settings, contributing to advancements in semiconductor technology.
Collaborations
Throughout her career, Arlene has collaborated with talented individuals such as Saravuth Sirinorakul and Yee Heong Chua. These partnerships have fostered a creative environment that has led to the development of her impactful inventions.
Conclusion
Arlene V Layson is a distinguished inventor whose work in semiconductor packaging has made a significant impact on the industry. Her innovative patents reflect her commitment to enhancing product reliability and performance.