This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Pitney Bowes Inc.. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: Aris Ballestrazzi: Innovator in Mailpiece Fabrication Systems
Introduction
Aris Ballestrazzi is a notable inventor based in Savignano s.P., Italy. He has made significant contributions to the field of mailpiece fabrication systems. His innovative approach has led to the development of a unique patent that enhances the efficiency of content delivery in packaging processes.
Latest Patents
Aris Ballestrazzi holds a patent for an "Inter-machine buffer for mailpiece fabrication system." This invention encompasses a system and method for wrapping sheet material to produce finished mailpieces. The system includes an upstream content module and a downstream mailpiece assembly module, which features a wrapper module designed to encapsulate content material. A buffer module is strategically placed between the upstream and downstream modules, incorporating multiple buffer gates that facilitate the conveyance of content material. The controller linked to these modules optimizes the delivery and insertion of content, ensuring minimal dry-holes and maintaining operational efficiency.
Career Highlights
Aris Ballestrazzi has been associated with Pitney Bowes Inc., a company renowned for its innovative solutions in mailing and shipping. His work has significantly impacted the efficiency of mailpiece production, showcasing his expertise in engineering and system design.
Collaborations
Throughout his career, Aris has collaborated with esteemed colleagues such as Carl L. Chapman and Arthur H. DePoi. These partnerships have fostered a creative environment that has led to advancements in their respective fields.
Conclusion
Aris Ballestrazzi's contributions to mailpiece fabrication systems exemplify the importance of innovation in enhancing operational efficiency. His patent reflects a deep understanding of engineering principles and a commitment to improving industry standards.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
