Piscataway, NJ, United States of America

Apurya Mehta

This inventor holds 1 USPTO granted patent. Top assignee: The Boc Group, Inc.. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Apurya Mehta. Retrieved from https://idiyas.com/inventor/apurya-mehta

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1994

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Apurya Mehta: Innovator in Wave Soldering Technology

Introduction

Apurya Mehta is a notable inventor based in Piscataway, NJ (US). She has made significant contributions to the field of soldering technology, particularly with her innovative approach to wave soldering methods.

Latest Patents

Apurya holds a patent for a "Wave soldering method and apparatus." This invention focuses on fluxing a substrate in a low oxygen containing atmosphere, preheating the fluxed substrate at least partially in a non-low oxygen containing atmosphere, and soldering the preheated substrate in a low oxygen containing atmosphere. This advancement is crucial for improving the quality and reliability of soldered connections in various electronic applications. She has 1 patent to her name.

Career Highlights

Apurya is currently employed at The BOC Group, Inc., where she continues to develop and refine soldering technologies. Her work has been instrumental in enhancing manufacturing processes and ensuring high standards in electronic assembly.

Collaborations

Apurya collaborates with various professionals in her field, including her coworker Sean M. Adams, who contributes to the innovative environment at The BOC Group, Inc.

Conclusion

Apurya Mehta's contributions to wave soldering technology exemplify her commitment to innovation and excellence in engineering. Her work not only advances the field but also sets a standard for future developments in soldering methods.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…