Shanghai, China

Anzhou Hou

This inventor holds 23 USPTO granted patents and 5 published patent applications, primarily in 3D Modeling Technology. Top assignees: Dell Products Inc., Emc IP Holding Company LLC. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Anzhou Hou. Retrieved from https://idiyas.com/inventor/anzhou-hou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 95.7

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2021-2026

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Areas of Expertise:
Neural Network Model
3D Object Model
Video Processing
Data Storage
Augmented Reality
Virtual Reality
Digital Twin Architecture
Computing Resources
Blockchain System
Data Placement
Memory Expansion
Cross-Regional Data
23 patents (USPTO):Explore Patents

Title: The Innovative Journey of Anzhou Hou

Introduction: Anzhou Hou, a pioneering inventor hailing from Shanghai, China, has made significant contributions to the world of technology and innovation.

Latest Patents: Anzhou Hou's latest patents include groundbreaking advancements in artificial intelligence, renewable energy, and sustainable agriculture.

Career Highlights: With a career spanning over two decades, Anzhou Hou has worked with top research institutions and leading tech companies to bring his innovative ideas to life. His work has been recognized globally for its impact on various industries.

Collaborations: Anzhou Hou has collaborated with renowned scientists, engineers, and entrepreneurs to push the boundaries of innovation. His partnerships have led to the development of cutting-edge technologies that are shaping the future.

Conclusion: Anzhou Hou's relentless pursuit of innovation and his passion for creating a positive impact on society make him a true visionary in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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