Anupam Dighe

Title: Innovations by Anupam Dighe

Introduction

Anupam Dighe is an accomplished inventor based in Kirkland, WA (US). He has made significant contributions to the field of packaging technology, holding two patents that showcase his innovative approach to solving complex problems in this area.

Latest Patents

Anupam Dighe's latest patents include a sealing mechanism with punches and dies for securing packages. This invention involves a process where packaging material is folded around an item, and punches are actuated to pierce through the material at designated locations. The system utilizes dies to receive portions of the punches, and presses compress the packaging material to ensure secure sealing. Another notable patent is for automated containers for packing multi-item packages. This system features an automated container equipped with wireless charging coils and moveable sidewalls. The controller in this system determines the sizes of items and adjusts the sidewalls accordingly to optimize packing efficiency.

Career Highlights

Anupam Dighe is currently employed at Amazon Technologies, Inc., where he continues to innovate and develop new solutions in packaging technology. His work has contributed to enhancing the efficiency and effectiveness of packaging processes.

Collaborations

Anupam has collaborated with notable coworkers, including Larry Joe Robb and Brian Quaglieri, who have also contributed to advancements in their respective fields.

Conclusion

Anupam Dighe's innovative patents and contributions to packaging technology reflect his commitment to improving efficiency and functionality in the industry. His work at Amazon Technologies, Inc. continues to pave the way for future advancements in this field.