This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 834,570 Years Active: 2003
Title: Antonino Scandurra: Innovator in Semiconductor Packaging
Introduction
Antonino Scandurra is a notable inventor based in Catania, Italy. He has made significant contributions to the field of semiconductor packaging through his innovative patent. His work focuses on enhancing the materials used in electronic devices, which is crucial for the advancement of technology.
Latest Patents
Antonino holds a patent for a "Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom." This invention involves a polymeric composition that includes at least one epoxy resin, a curing agent, and a silica-based reinforcing filler. The composition is designed to improve the packaging of semiconductor devices, ensuring better performance and reliability.
Career Highlights
Throughout his career, Antonino has demonstrated a commitment to innovation in the semiconductor industry. His patent reflects his expertise in materials science and engineering, showcasing his ability to develop solutions that meet the demands of modern electronics.
Collaborations
Antonino has worked alongside talented colleagues such as Roberto Zafarana and Salvatore Pignataro. Their collaborative efforts have contributed to advancements in semiconductor technology and packaging materials.
Conclusion
Antonino Scandurra is a distinguished inventor whose work in polymeric compositions for semiconductor packaging has made a significant impact on the industry. His innovative approach continues to influence the development of electronic devices, paving the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile