Anton Winkler

Title: Anton Winkler: Semiconductor Packaging Inventor

Introduction

Anton Winkler is an inventor associated with Freising, Germany, and Texas Instruments Corporation. His work includes a patent for a system-in-a-package design that integrates capacitors with a semiconductor chip and inductor. The available information lists 1 patent.

Latest Patents

Winkler’s listed patent, “Electronic Device Package with Vertically Integrated Capacitors,” describes a system-in-a-package with a semiconductor chip embedded in a dielectric substrate. An inductor sits on the substrate’s top surface and connects to the chip. A thin-film capacitor can be positioned between the inductor and substrate. The design also describes a second thin-film capacitor placed on the chip’s top surface or embedded in the substrate, with a thermal pad on the substrate’s bottom surface to help dissipate heat.

Career Highlights

Winkler is associated with Texas Instruments Corporation, a company known for developing semiconductor technologies. His patented packaging concept combines electrical components in a compact structure while addressing heat dissipation.

Collaborations

Frank Stepniak is identified as Winkler’s coworker. The available information does not specify their particular projects or professional contributions together.

Conclusion

Anton Winkler’s listed patent focuses on vertically integrating capacitors into a semiconductor package, combining compact component integration with a provision for thermal management.