Darien, CT, United States of America

Anthony Tolla


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 2000

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2 patents (USPTO):Explore Patents

Title: Anthony Tolla: Innovator in Electrical Bonding Technologies

Introduction

Anthony Tolla is a notable inventor based in Darien, CT (US). He has made significant contributions to the field of electrical bonding technologies, holding 2 patents that showcase his innovative methods and apparatuses.

Latest Patents

Tolla's latest patents include a "Method and apparatus for producing an electrical bond between conductors." This invention involves a system that comprises a power source and a weld head, designed to create a reliable electrical bond between a conductor and an electrical connector contact. The apparatus features a first polarity output and a second polarity output, with electrodes that facilitate the bonding process through a series of precise steps. Another patent, "Method for producing an electrical bond between conductors," details a process for bonding a bifurcated contact element of an electrical connector with a conductor. This method emphasizes the importance of positioning and applying a predetermined force to ensure effective electrical contact.

Career Highlights

Throughout his career, Anthony Tolla has worked with several companies, including C&M Technologies Group, Inc. and C&M Incorporated. His experience in these organizations has contributed to his expertise in electrical bonding technologies.

Collaborations

Tolla has collaborated with notable coworkers such as Thaddeus Grabowski and William J. Tkazyik. Their combined efforts have likely enhanced the development and refinement of Tolla's innovative technologies.

Conclusion

Anthony Tolla's contributions to electrical bonding technologies through his patents and career experiences highlight his role as a significant innovator in the field. His work continues to influence advancements in electrical connections and bonding methods.

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