Singapore, Singapore

Anthony Sun-Yi Sheng


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Anthony Sun-Yi Sheng: Innovator in Semiconductor Technology

Introduction

Anthony Sun-Yi Sheng is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He has developed innovative solutions that enhance the performance and efficiency of semiconductor packages. His work is particularly significant in the field of thermally enhanced semiconductor packaging.

Latest Patents

Anthony holds a patent for a "Thermally enhanced semiconductor package and method of producing the same." This invention features a heat sink structure designed for use in semiconductor packages. The design includes a ring structure with down sets, which can be slanted or V-shaped, and a heat sink connected to the ring structure. The manufacturing method involves several steps, including inserting a substrate with an attached semiconductor chip into a mold, placing a heat sink structure on the substrate, and injecting an encapsulant to form a complete semiconductor package. This innovative approach ensures effective heat dissipation and enhances the reliability of semiconductor devices. He has 1 patent to his name.

Career Highlights

Anthony is currently employed at United Test and Assembly Center Limited, where he applies his expertise in semiconductor technology. His role involves collaborating with a team of skilled professionals to develop advanced packaging solutions that meet the demands of the electronics industry.

Collaborations

Throughout his career, Anthony has worked alongside talented colleagues, including Kolan Ravi Kanth and Danny Retuta. Their collaborative efforts contribute to the innovative environment at United Test and Assembly Center Limited.

Conclusion

Anthony Sun-Yi Sheng is a distinguished inventor whose work in semiconductor technology has made a significant impact. His innovative patent for thermally enhanced semiconductor packages showcases his commitment to advancing the field. His contributions continue to influence the development of efficient and reliable electronic devices.

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