Osterville, MA, United States of America

Anthony Giovannone


Average Co-Inventor Count = 1.1

ph-index = 5

Forward Citations = 87(Granted Patents)


Company Filing History:


Years Active: 1995-1998

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5 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Anthony Giovannone

Introduction

Anthony Giovannone is a notable inventor based in Osterville, MA (US). He has made significant contributions to the field of plastic manufacturing, holding a total of five patents. His work focuses on improving methods and systems for thermoforming plastic articles, showcasing his expertise and innovative spirit.

Latest Patents

Giovannone's latest patents include a "Method of thermoforming plastic articles" and a "System for making plastic blister packages." The first patent describes a precut die apparatus designed for use in a thermoform-trimming method. This apparatus is strategically positioned between the form press and the trim station, allowing for precise alignment of molded articles during the trimming operation. The second patent outlines an apparatus and method for packaging articles in a plastic-card package. This innovative system involves a flat card with a window aperture and a thermoformable plastic sheet, which is heat tacked and formed into a blister to create a secure package.

Career Highlights

Giovannone works at Sencorp Systems, Inc., where he continues to develop and refine his innovative ideas. His contributions to the company have been instrumental in advancing their capabilities in plastic packaging and manufacturing technologies.

Collaborations

One of his notable coworkers is David Mitchell, with whom he collaborates on various projects within the company. Their combined expertise enhances the innovative output of Sencorp Systems, Inc.

Conclusion

Anthony Giovannone's work exemplifies the spirit of innovation in the field of plastic manufacturing. His patents reflect a commitment to improving processes and systems, making significant strides in the industry. His contributions will undoubtedly continue to influence the future of plastic packaging and thermoforming technologies.

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