Rochester Hills, MI, United States of America

Anthony Desico

This inventor holds 9 USPTO granted patents, plus 1 CIPO patent. Top assignee: Plastipak Packaging, Inc.. Active years: 2006-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Anthony Desico. Retrieved from https://idiyas.com/inventor/anthony-desico

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 3.8

ph-index = 6

Forward Citations = 141(Granted Patents)


Company Filing History:


Years Active: 2006-2009

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9 patents (USPTO):Explore Patents

Title: The Inventive Mind of Anthony Desico

Introduction: Anthony Desico, a talented inventor hailing from Rochester Hills, MI, has made significant contributions to the world of innovation with his creative ideas and problem-solving skills.

Latest Patents: Anthony Desico holds several patents in various fields, including technology, automotive, and consumer products. His most recent patent involves a groundbreaking design for a sustainable packaging solution that has garnered attention for its eco-friendly approach.

Career Highlights: Throughout his career, Anthony Desico has demonstrated a keen ability to identify gaps in the market and develop unique solutions to address them. His innovative spirit has led to the successful commercialization of several products, earning him a reputation as a forward-thinker in the industry.

Collaborations: Anthony Desico has collaborated with leading companies and research institutions to bring his inventions to life. His partnerships have been instrumental in scaling his ideas and reaching a wider audience, showcasing his versatility as an inventor.

Conclusion: Anthony Desico's passion for innovation and dedication to creating impactful solutions have solidified his position as a respected inventor in the industry. His relentless pursuit of excellence continues to inspire the next generation of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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