This inventor holds 1 USPTO granted patent. Top assignee: Qualcomm Incorporated. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Anshih Tseng: Innovator in Wafer Level Packaging Technology
Introduction
Anshih Tseng is a notable inventor based in San Diego, California. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer level packaging. His innovative work has led to advancements that benefit the electronics industry.
Latest Patents
Anshih Tseng holds a patent for a "Wafer Level Packaging Process for Thin Film Inductors." This patent showcases his expertise in developing efficient packaging solutions that enhance the performance of electronic devices. He has 1 patent to his name, reflecting his commitment to innovation in this specialized field.
Career Highlights
Tseng is currently employed at Qualcomm Incorporated, a leading company in wireless technology and semiconductor manufacturing. His role at Qualcomm allows him to work on cutting-edge projects that push the boundaries of technology. His contributions have been instrumental in advancing the company's product offerings.
Collaborations
Anshih Tseng collaborates with talented professionals in his field, including his coworker Joseph Dibene. Together, they work on innovative projects that aim to improve semiconductor technologies and packaging processes.
Conclusion
Anshih Tseng is a dedicated inventor whose work in wafer level packaging has made a significant impact on the electronics industry. His contributions at Qualcomm Incorporated and his patent demonstrate his commitment to advancing technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile