Anru Andrew Cheng

Title: Anru Andrew Cheng: Innovator in MEMS Technology

Introduction

Anru Andrew Cheng is a notable inventor based in Cupertino, CA (US). He has made significant contributions to the field of micro-electro-mechanical systems (MEMS). His innovative work has led to the development of advanced packaged MEMS devices.

Latest Patents

Cheng holds a patent for a "Wafer level chip scale packaged micro-electro-mechanical-system (MEMS) device and methods of producing thereof." This patent describes a packaged MEMS device that includes a substrate with an active surface featuring an integrated circuit. The device incorporates two substrate pads, one of which is a closed ring pad. Additionally, it includes a cap wafer with two wafer pads, one also being a closed ring pad. A hermetic seal ring is formed through bonding between the two ring pads. The device features a gap between the substrate and the cap wafer, which can be filled with a pressurized gas. An electrical connection is established through bonding between one substrate pad and one wafer pad, with an electrical contact placed over the cap wafer. An insulation layer is also included between the electrical contact and the cap wafer. Methods for producing these packaged MEMS devices are also outlined in the patent.

Career Highlights

Cheng is currently employed at Memsic, Inc., where he continues to innovate in the MEMS field. His work has been instrumental in advancing the technology and applications of MEMS devices.

Collaborations

Cheng collaborates with Piu Francis Man, contributing to the development of cutting-edge MEMS technologies.

Conclusion

Anru Andrew Cheng is a prominent figure in the MEMS industry, with a focus on innovative packaged devices. His contributions are shaping the future of micro-electro-mechanical systems.