Beijing, China

Anqin Luo

This inventor holds 1 USPTO granted patent. Top assignee: Beijing Smartchip Microelectronics Technology Comp. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Anqin Luo. Retrieved from https://idiyas.com/inventor/anqin-luo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Anqin Luo and Patent Innovation in Topology Recognition Model Compression.

Introduction

Anqin Luo is an inventor based in Beijing, China. Her patent work includes a method for compressing topology recognition models for use in Internet of Things in Power Systems (IOTIPS) terminals. She is associated with Beijing Smartchip Microelectronics Technology Co.

Latest Patents

Luo’s listed patent is “Method and Apparatus for Compressing Topology Recognition Model, Electronic Device, and Medium.” The invention describes a process that repeatedly prunes and trains a neural network model, then reduces the bit quantity of its weight parameters and trains it again. These steps continue until a compressed topology recognition model is produced for deployment on an IOTIPS terminal. The approach is intended to reduce the model’s size.

Career Highlights

Luo’s listed portfolio includes 1 patent. Her work focuses on model compression for topology recognition, combining pruning and quantization to make a model more compact for deployment.

Collaborations

Luo’s listed coworkers include Jianan Yuan and Chao Huo. Her patent is associated with Beijing Smartchip Microelectronics Technology Co.

Conclusion

Anqin Luo’s patent describes a structured approach to compressing topology recognition models, supporting their deployment on resource-constrained power-system IoT terminals.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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