Ankur Agarwal

Title: Ankur Agarwal: Innovator in Photonic Packaging Technology

Introduction

Ankur Agarwal is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of electronic packaging, particularly in the area of photonic technology. His innovative work has led to the development of a patent that addresses critical issues in electronic package design.

Latest Patents

Ankur Agarwal holds a patent for a "Photonic package laser area macro-void pressure relief micro-channels." This invention includes electronic packages with vents designed to prevent pressure buildup beneath a die. The electronic package comprises a package substrate and a die attached to the substrate by interconnects. An underfill surrounds the interconnects and is positioned beneath the die. A void is incorporated in the underfill, along with a vent that is fluidically coupled to the void and extends to the edge of the underfill. This innovative design enhances the reliability and performance of electronic packages.

Career Highlights

Ankur Agarwal is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing and electronic design. His role at Intel allows him to work on cutting-edge technologies and contribute to the development of innovative solutions in the electronics industry.

Collaborations

Ankur collaborates with Priyanka Dobriyal, a coworker who shares his passion for innovation and technology. Together, they work on projects that push the boundaries of electronic packaging and photonic applications.

Conclusion

Ankur Agarwal's contributions to the field of electronic packaging through his innovative patent demonstrate his commitment to advancing technology. His work at Intel Corporation and collaborations with fellow inventors highlight the importance of teamwork in driving innovation. Ankur's achievements serve as an inspiration for future inventors in the industry.