This inventor holds 1 USPTO granted patent. Top assignee: National Semiconductor Corporation. Active years: 2013.
Company Filing History:
Years Active: 2013
Title: Aninyda Poddar: Innovator in Integrated Circuit Packaging
Introduction
Aninyda Poddar is a notable inventor based in Sunnyvale, CA (US). He has made significant contributions to the field of integrated circuit packaging, showcasing his innovative spirit through his patented inventions.
Latest Patents
Aninyda holds a patent for a foil-based method for packaging integrated circuits. This invention involves a process where a metallic foil and a photoresist layer are attached with a carrier. The photoresist layer is then exposed and patterned, allowing for the connection of multiple integrated circuit dice to the foil. The dice and portions of the foil are encapsulated in a molding material, and the foil is etched based on the patterned photoresist layer to define multiple device areas, each supporting at least one integrated circuit die.
Career Highlights
Aninyda is associated with National Semiconductor Corporation, where he has been able to apply his expertise in integrated circuit technology. His work has contributed to advancements in the efficiency and effectiveness of electronic packaging solutions.
Collaborations
Aninyda has collaborated with talented coworkers such as Nghia Thuc Tu and Hau Thanh Nguyen, further enhancing the innovative environment at National Semiconductor Corporation.
Conclusion
Aninyda Poddar's contributions to integrated circuit packaging through his innovative patent demonstrate his commitment to advancing technology in the electronics field. His work continues to influence the industry and inspire future innovations.