Montreal, Canada

Animesh Saha Shovan

This inventor holds 1 USPTO granted patent and 1 published patent application. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Animesh Saha Shovan. Retrieved from https://idiyas.com/inventor/animesh-saha-shovan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Animesh Saha Shovan: Inventor of an Implantable Sensor Assembly

Introduction

Animesh Saha Shovan is an inventor based in Montreal, Canada. His patent work includes an implantable sensor assembly designed to support a sensor within a compact structure.

Latest Patents

Shovan is associated with 1 patent: “Implantable Sensor Assembly Including a Sensor and a Compliant Structure.” The invention describes a support structure with a board and a compliant structure on its top surface, which holds a sensor above the board. An aperture in the support structure exposes at least part of the sensor’s face. In one implementation, the sensor is a pressure sensor with a sensing membrane exposed through the aperture.

The assembly may also include a stiffener mounted beneath the board. The sensor and other components can be enclosed by a polymer shell with a conductive cover or by gel contained within a rigid cap. An electrical connection between the conductive cover or cap and the conductive stiffener can form an electromagnetic shield.

Career Highlights

The patent reflects Shovan’s work on implantable sensor packaging, including compliant support, sensor exposure, and electromagnetic shielding. These design features address how a sensor can be supported and protected within an implantable assembly.

Collaborations

Shovan’s listed coworkers include George Xereas and Charles Allan.

Conclusion

Animesh Saha Shovan’s patent describes an implantable sensor assembly that combines a compliant sensor support with protective enclosure options and electromagnetic shielding.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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