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Raleigh, NC, United States of America

Angus Kingon

This inventor holds 3 USPTO granted patents. Top assignee: Fujitsu Corporation. Active years: 2006-2007.

USPTO Granted Patents = 3

Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 5(Granted Patents)

Company Filing History:

3 out of 39,363

Fujitsu Corporation

Years Active: 2006-2007

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3 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7241656 - Semiconductor device and its manufacture method, and measurement fixture for the semiconductor device (2007-07-10),

2. 7239026 - Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip (2007-07-03),

3. 7075135 - Semiconductor device having a stress layer for applying tensile of compressive stress to the ferroelectric film (2006-07-11),

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