Company Filing History:
Years Active: 2024
Title: **The Innovative Journey of Angelito Barrozo Perez in Electronics Packaging**
Introduction
Angelito Barrozo Perez is an accomplished inventor based in Singapore, SG. With a focus on enhancing electronic device packaging, he has made significant contributions to the field with his innovative approach. His sole patent reflects his expertise in developing advanced encapsulation processes.
Latest Patents
Angelito holds a noteworthy patent titled "Encapsulation process for double-sided cooled packages." This invention involves the encapsulation of one or more electronic devices mounted on a substrate. The process employs a cooling plate in contact with the devices, utilizing a unique mold setup to achieve an effective sealing pressure while managing various fill pressures of a molding compound. This technology is essential for ensuring the longevity and performance of high-performance electronics.
Career Highlights
Angelito is currently working with Asmpt Singapore Pte. Ltd., where he continues to develop groundbreaking innovations in the electronics industry. His role at the company has allowed him to apply his inventive skills to create solutions that address the complex challenges faced in modern electronics packaging.
Collaborations
At Asmpt Singapore Pte. Ltd., Angelito collaborates with talented coworkers such as Teng Hock Kuah and Yi Yu Lin. These partnerships enable a vibrant exchange of ideas and foster a productive environment where innovative solutions can thrive.
Conclusion
With his patent and collaborative efforts in the field of electronics packaging, Angelito Barrozo Perez exemplifies the spirit of innovation. His work not only enhances existing technologies but also paves the way for future advancements in electronics. As the industry evolves, Angelito's contributions will remain vital to achieving new heights in electronic device efficiency and reliability.