Berlin, Germany

Angelika Harndt

This inventor holds 2 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignee: Waldemar Link Gmbh &Co. Kg. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Angelika Harndt. Retrieved from https://idiyas.com/inventor/angelika-harndt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Angelika Harndt - Innovator in Implant Technology

Introduction

Angelika Harndt is a notable inventor based in Berlin, Germany. She is currently associated with Waldemar Link GmbH & Co. KG, where she focuses on advancements in implant technology. Despite having no granted patents to her name, her contributions to the field are significant.

Latest Patent Applications

Angelika Harndt has been involved in several innovative patent applications. One of her latest applications is for an "Implant Component Assembly," which provides a comprehensive solution for joint replacement. This assembly includes an implant component with an interface part for attaching another implant component and an assembly channel. It also features an assembly screw designed to secure the other implant component, allowing for rotation about its longitudinal axis.

Another application is for an "Implant Component," specifically a humeral implant component that connects to another humeral implant component. This component is designed with a tapered interface part that facilitates a secure connection, enhancing the overall functionality of joint replacements.

Conclusion

Angelika Harndt's work in the field of implant technology showcases her innovative spirit and dedication to improving medical solutions. Her latest patent applications reflect her commitment to advancing joint replacement technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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