Andrew V Kearney

Title: Andrew V Kearney: Innovator in Semiconductor Technology

Introduction

Andrew V Kearney is a notable inventor based in Santa Clara, CA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the reliability and efficiency of semiconductor packages.

Latest Patents

Kearney's latest patents include a method of fabricating a semiconductor package with an integrated substrate thermal slug. This innovation aims to reduce thermal stresses that may arise from differences in thermal expansion coefficients between a molded casing and the active side of a semiconductor device. By arranging the active side of the semiconductor device face-down towards a substrate, Kearney's design minimizes failures caused by thermal stresses. The semiconductor device features a through via that electrically connects the active side to the passive side, with a wire bond linking the passive side to the substrate. Additionally, to enhance heat dissipation, a thermally conductive slug can be integrated into the substrate, allowing the active side of the semiconductor device to be attached to it.

Career Highlights

Andrew V Kearney is currently employed at Cisco Technology, Inc., where he continues to innovate in the semiconductor field. His expertise and contributions have positioned him as a valuable asset to the company.

Collaborations

Kearney collaborates with Peng Su, further enhancing the innovative efforts within their team.

Conclusion

Andrew V Kearney's work in semiconductor technology exemplifies the importance of innovation in enhancing device reliability and performance. His patents reflect a commitment to advancing the field and addressing critical challenges in semiconductor design.