This inventor holds 1 USPTO granted patent. Top assignee: Vicor Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations by Andrew T D' Amico in Electronic Assembly Technology
Introduction
Andrew T D' Amico is an accomplished inventor based in Beverly Hills, CA. He has made significant contributions to the field of electronic assembly technology. His innovative approach focuses on reducing waste and enhancing the efficiency of electronic component encapsulation.
Latest Patents
Andrew T D' Amico holds a patent for a method of encapsulating panel-molded electronic assemblies. This invention aims to minimize wasted printed circuit board area by allowing a panel of electronic components, such as power converters, to be cut into individual pieces after encapsulation. The design includes features that enhance heat removal and structural integrity, making it a valuable advancement in the industry. His patent includes 1 patent.
Career Highlights
Andrew is currently employed at Vicor Corporation, where he continues to develop innovative solutions in electronic assembly. His work has been instrumental in advancing the technology used in power converters and other electronic components.
Collaborations
Throughout his career, Andrew has collaborated with notable professionals in the field, including Patrizio Vinciarelli and Michael B LaFleur. These collaborations have contributed to the success of his projects and innovations.
Conclusion
Andrew T D' Amico's contributions to electronic assembly technology demonstrate his commitment to innovation and efficiency. His patent for panel-molded electronic assemblies showcases his ability to address industry challenges effectively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile