Poughkeepsie, NY, United States of America

Andrew Michael Reitter


Average Co-Inventor Count = 11.3

ph-index = 4

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 1996-2001

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8 patents (USPTO):

Title: Andrew Michael Reitter: Innovator in Aluminum Nitride Technology

Introduction

Andrew Michael Reitter is a notable inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of materials science, particularly in the development of methods for controlling defects in aluminum nitride. With a total of 8 patents to his name, Reitter's work has had a substantial impact on electronic packaging technologies.

Latest Patents

Among his latest patents is a method for controlling certain second phases in aluminum nitride. This innovation addresses the issue of ceramic defects that can occur in electronic packages with a high area percent coverage of blanket metal. The defects are often related to the decomposition of the liquid sintering aid. In his experiments, Reitter introduced unique additions to the metallization process, which successfully prevented the formation of these ceramic defects. His approach involves a unique composition that enhances an existing process, showcasing his innovative thinking in materials engineering.

Career Highlights

Reitter has had a distinguished career, working with prominent companies such as IBM and The Carborundum Company. His experience in these organizations has allowed him to refine his expertise in materials science and contribute to groundbreaking advancements in the field.

Collaborations

Throughout his career, Reitter has collaborated with talented individuals, including Carla Natalia Cordero and Benjamin V Fasano. These collaborations have further enriched his work and led to innovative solutions in the industry.

Conclusion

Andrew Michael Reitter is a prominent figure in the field of materials science, particularly known for his innovative methods in aluminum nitride technology. His contributions have not only advanced the understanding of ceramic defects but have also paved the way for improved electronic packaging solutions.

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