This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignees: Amcor Flexibles North America, Inc., Bemis Company, Inc.. Active years: 2022-2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022-2024
Title: Andrew J Lischefski: Innovator in Packaging Technology
Introduction
Andrew J Lischefski is a notable inventor based in Kangasala, Finland. He has made significant contributions to the field of packaging technology, holding 2 patents that showcase his innovative approach to creating functional and efficient packaging solutions.
Latest Patents
Lischefski's latest patents include the "Tray Composite, Package and Method" and the "Ovenable Package." The tray composite patent describes a polymeric-based liner that features an exterior surface layer, an interior surface layer, and a formed base that is removably affixed to the interior surface layer. This design allows for manual separation of the components after use. The ovenable package patent details a tray composite that incorporates a polymeric-based liner and a fiber-based component. This innovative design utilizes polyolefin materials for adhesion and separation, as well as high-temperature resistant polymers, making the tray suitable for cooking or reheating food items.
Career Highlights
Throughout his career, Andrew has worked with prominent companies in the packaging industry, including Amcor Flexibles North America, Inc. and Bemis Company, Inc. His experience in these organizations has contributed to his expertise in developing advanced packaging solutions.
Collaborations
Lischefski has collaborated with talented individuals such as Tara Kay Cruz and Hanna-Mari Lahti, further enhancing his innovative projects and contributions to the field.
Conclusion
Andrew J Lischefski is a distinguished inventor whose work in packaging technology has led to the development of practical and innovative solutions. His patents reflect a commitment to improving the functionality and efficiency of packaging materials.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
