Spokane Valley, WA, United States of America

Andrew D Delano

USPTO Granted Patents = 2 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2016-2017

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2 patents (USPTO):Explore Patents

Title: The Innovative Mind of Andrew D. Delano

Introduction: Andrew D. Delano, an inventive spirit based in Spokane Valley, WA, is known for his significant contributions to thermal interface materials. With a total of two patents under his name, Delano has made strides in enhancing heat transfer materials, essential for various technological applications.

Latest Patents: Andrew's latest patent focuses on a thermal interface material and method of making and using the same. This innovative material comprises a polymeric elastomer, a thermally conductive filler, and a coupling agent, along with other optional components. One exemplary formulation includes a coupling agent that is either a cyclic structure or follows a specified formula, showcasing Delano's commitment to advancing efficient thermal management solutions.

Career Highlights: Delano is currently associated with Honeywell International Inc., where he applies his expertise in material science and thermal management. His role at Honeywell has allowed him to be at the forefront of innovation in the field, contributing to the development of cutting-edge technologies.

Collaborations: Throughout his career, Andrew has collaborated with talented individuals, including coworkers Natalie Ann Merrill and David E. Steele. These partnerships not only foster creativity and innovation but also emphasize the importance of teamwork in pioneering new inventions and enhancing existing technologies.

Conclusion: Andrew D. Delano's work exemplifies the spirit of innovation, particularly in the realm of thermal interface materials. His patents underscore the significant impact that inventive minds have on advancing technology, showcasing his dedication to practical and efficient solutions in the field. Delano's contributions will undoubtedly continue to shape the future of heat transfer technology.

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