Andrew C Durston

Title: **Inventor Profile: Andrew C. Durston**

Introduction

Andrew C. Durston is an accomplished inventor based in Lakehurst, New Jersey. He has made notable contributions to the field of electrical engineering with a focus on innovative interconnection systems for circuit boards. Durston's ingenuity has resulted in the securing of a patent that addresses key challenges in the manufacturing of multi-layer backplane boards.

Latest Patents

Andrew holds a patent for a "High Density Cross-Connection System." This invention integrates secondary backplane boards with a main backplane board, facilitating interconnection paths in a transverse direction. This design innovation ensures that the limitations of current manufacturing capabilities are exceeded, resulting in enhanced efficiency and performance in multi-layer backplane applications.

Career Highlights

Durston has had a fruitful career at Lucent Technologies Inc., a company at the forefront of telecommunications and networking technology. His work involves research and development aimed at advancing the capabilities and functionalities of electronic systems. His patent is a testament to his skillful approach in navigating complex engineering challenges.

Collaborations

Throughout his career, Andrew has collaborated with esteemed colleagues such as Liang Hwang and Hector Francisco Rodriguez. Together, they have contributed to various projects within the company, pooling their expertise and creativity to bring about significant advancements in technology.

Conclusion

In summary, Andrew C. Durston stands out as an influential inventor with a focus on improving multi-layer backplane systems. His patent for the high density cross-connection system reflects his innovative spirit and commitment to pushing the boundaries of technological capability. With continued collaboration and research, Durston is likely to make further contributions to the field of electrical engineering.